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US10660214B2

Methods for connecting inter-layer conductors and components in 3D structures

University of Texas System

Abstract

Systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.

University
University of Texas System
Assignee
Board Of Regents, The University Of Texas System
Inventor
Ryan B. Wicker
Priority date
January 04, 2012
Filing date
June 17, 2016
Grant date
May 19, 2020
Publication date
May 19, 2020
Language
en
Metadata fetched
August 29, 2026 00:26