← All patents

US10962297B2

Multidimensional heat transfer system for cooling electronic components

University of Texas System

Abstract

Devices, methods, and systems for facilitating heat transfer and cooling electronic components are presented. A system for cooling an electronic component includes a cold core, a plurality of solid state cooling devices, and a plurality of heat sinks. The cold core may define one or more cavities …

University
University of Texas System
Assignee
Board Of Regents, The University Of Texas System
Inventor
Dereje Agonafer
Priority date
February 21, 2011
Filing date
February 21, 2012
Grant date
March 30, 2021
Publication date
March 30, 2021
Language
en
Metadata fetched
August 29, 2026 00:28