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US12632634B2

Nanofabrication and design techniques for 3D ICs and configurable ASICs

University of Texas System

Abstract

Various embodiments of the present technology provide for the ultra-high density heterogenous integration, enabled by nano-precise pick-and-place assembly. For example, some embodiments provide for the integration of modular assembly techniques with the use of prefabricated blocks (PFBs). These …

University
University of Texas System
Assignee
Board Of Regents, The University Of Texas System
Inventor
Sidlgata V. Sreenivasan
Filing date
December 14, 2022
Grant date
May 19, 2026
Publication date
May 19, 2026
Language
en
Metadata fetched
August 29, 2026 00:40