← All patents

US20140268607A1

Methods and Systems For Connecting Inter-Layer Conductors and Components in 3D …

University of Texas System

Abstract

The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

University
University of Texas System
Assignee
Board Of Regents, The University Of Texas System
Inventor
Ryan B. Wicker
Priority date
January 04, 2012
Filing date
March 14, 2013
Publication date
September 18, 2014
Language
en
Metadata fetched
August 29, 2026 00:21