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US20170225273A1

Connecting metal foils/wires and components in 3d printed substrates with wire …

University of Texas System

Abstract

A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method thereof. One or more layers of a three-dimensional structure are deposited on a substrate. The three-dimensional structure is configured to include one or more internal cavities …

University
University of Texas System
Assignee
Board Of Regents, The University Of Texas System
Inventor
Eric MacDonald
Priority date
February 08, 2016
Filing date
February 07, 2017
Publication date
August 10, 2017
Language
en
Metadata fetched
August 29, 2026 00:24