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US20170359896A1

Apparatus and method for configuring a vertical interconnection access and a …

University of Texas System

Abstract

A 3D printed circuit apparatus includes a 3D printed circuit having a surface layer and one or more wires embedded under the surface layer, and a conductive metal pin that is cut to a desired length and inserted into the 3D printed circuit in order to attain contact with the wire or wires embedded …

University
University of Texas System
Assignee
Board Of Regents, The University Of Texas System
Inventor
Chi Yen Kim
Priority date
June 14, 2016
Filing date
June 09, 2017
Publication date
December 14, 2017
Language
en
Metadata fetched
August 29, 2026 00:25