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US20220139717A1

Large area metrology and process control for anisotropic chemical etching

University of Texas System

Abstract

Various embodiments of the present technology generally relate to semiconductor device architectures and manufacturing techniques. More specifically, some embodiments of the present technology relate to large area metrology and process control for anisotropic chemical etching. Catalyst influenced …

University
University of Texas System
Assignee
Board Of Regents, The University Of Texas System
Inventor
Sidlgata V. Sreenivasan
Priority date
February 25, 2019
Filing date
February 24, 2020
Publication date
May 05, 2022
Language
en
Metadata fetched
August 29, 2026 00:29