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US20230411178A1

Equipment and process technologies for catalyst influenced chemical etching

University of Texas System

Abstract

A method and system for etching a semiconductor substrate using catalyst influenced chemical etching. A group of independently controlled discrete actuators are configured to control a depth of an etch of a material on a substrate, where at least two of the group of independently controlled …

University
University of Texas System
Assignee
Board Of Regents, The University Of Texas System
Inventor
Sidlgata V. Sreenivasan
Priority date
October 29, 2020
Filing date
October 29, 2021
Publication date
December 21, 2023
Language
en
Metadata fetched
August 29, 2026 00:31