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US20240395578A1

Tool and processes for pick-and-place assembly

University of Texas System

Abstract

A system for assembling a first substrate to a second substrate. One or more deformable substrate chucks are utilized to match a topography of a bonding surface on the first substrate to a topography of a bonding surface on the second substrate, where a volatile lubricant is utilized during an …

University
University of Texas System
Assignee
Board Of Regents, The University Of Texas System
Inventor
Sidlgata V. Sreenivasan
Priority date
September 30, 2021
Filing date
September 30, 2022
Publication date
November 28, 2024
Language
en
Metadata fetched
August 29, 2026 00:31