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US20240407148A1

Tool and processes for pick-and-place assembly

University of Texas System

Abstract

A system for assembling a group of dies from a source substrate onto a transfer substrate. A high-throughput low-precision system is configured to pick the group of dies from the source substrate and placed onto an intermediate substrate, where the placement of the group of dies onto the …

University
University of Texas System
Assignee
Board Of Regents, The University Of Texas System
Inventor
Sidlgata V. Sreenivasan
Priority date
September 30, 2021
Filing date
September 30, 2022
Publication date
December 05, 2024
Language
en
Metadata fetched
August 29, 2026 00:31